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Title:
VEHICULAR BUMPER DEVICE
Document Type and Number:
Japanese Patent JP2010100190
Kind Code:
A
Abstract:

To economically and efficiently form a vehicular bumper device with high strength and high freedom of selection of a reinforcement method.

A bumper body 1 obtained by molding a metal plate in a cylindrical shape is provided, recession groove parts 4 are formed on a back surface part 3 facing to a vehicle body side on the bumper body 1 and a surface part 2 positioned at an opposite side to the back surface part 3 respectively. The mutual recession groove part 4a of the surface part 2 and the recession groove part 4b of the back surface part 3 are arranged in the state that they are not abutted on each other and at least a part is superposed in an opposed direction of the surface part 2 and the back surface part 3.


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Inventors:
HANEDA SHINICHI
MASAYASU JUN
KITA KYOICHI
OBAYASHI TAMAKI
Application Number:
JP2008274244A
Publication Date:
May 06, 2010
Filing Date:
October 24, 2008
Export Citation:
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Assignee:
AISIN SEIKI
AISIN KEIKINZOKU CO LTD
International Classes:
B60R19/04
Domestic Patent References:
JP2008503382A2008-02-07
JPH07246894A1995-09-26
JP2007535437A2007-12-06
JPH1134140A1999-02-09
JPS5950860U1984-04-04
JP2008504162A2008-02-14
JPH07246894A1995-09-26
JP2007535437A2007-12-06
JP2008503382A2008-02-07
JPH1134140A1999-02-09
JPS5950860U1984-04-04
JP2008504162A2008-02-14
JP2006240441A2006-09-14
Foreign References:
US6349521B12002-02-26
US6349521B12002-02-26
Attorney, Agent or Firm:
Shuichiro Kitamura
Mountain Saki Tetsuya



 
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