Title:
VERTICAL FURNACE FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3265498
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a vertical furnace for a semiconductor wafer which can automatically transfer a semiconductor wafer and is capable of film formation, diffusion, etc. only for a single surface.
SOLUTION: This vertical furnace for a semiconductor wafer consists of a furnace body having a vertical furnace core tube, a boat 1 inserted in the furnace tube, a plate main body 7 which is horizontally fixed to the inside of the boat and has a notched part 6 opened on the periphery, and a detaching part 8 which is installed on the notched part from above and can retain a wafer W together with the plate main body. A wafer mounting plate 5 for mounting a wafer, and a robot main body 1 which can rotate around a vertical shaft as a center and moves vertically and horizontally are installed. The boat consists of two thin arms 12 which reciprocate in the horizontal direction and retain a wafer, and a rectangular frame type arm 13 which is positioned between the arms, can move vertically and horizontally, and retains the detaching part. A wafer transferring robot 10 which tranfers a wafer between the boat and a wafer cassette is installed.
Inventors:
Kenichi Takesako
Application Number:
JP24556996A
Publication Date:
March 11, 2002
Filing Date:
August 28, 1996
Export Citation:
Assignee:
Toshiba Ceramics Co., Ltd.
International Classes:
H01L21/677; H01L21/205; H01L21/22; H01L21/31; H01L21/68; (IPC1-7): H01L21/205; H01L21/22; H01L21/31; H01L21/68
Domestic Patent References:
| JP6271009A | ||||
| JP4137646A | ||||
| JP63102225A | ||||
| JP661328A | ||||
| JP63170464U |
Attorney, Agent or Firm:
Yujiro Taka
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