To provide a via forming apparatus for multilayer printed boards, which is capable of simply forming vias hardly causing electric continuity failures between conductor layers at a high speed and a low cost.
The via forming apparatus 1 comprises a laser boring chamber 20, an UV irradiation chamber 30 capable of being purged with nitrogen gas and a transporting means 70, holes for vias are formed by a laser beam emitted from a laser oscillator 22 on the substrate S carried into the laser boring chamber 20, the substrate S carried into the UV irradiating chamber 30 by the transporting means 70 is irradiated with UV rays from excimer lamps 32, and the UV irradiation makes the substrate S surface hydrophilic, this facilitating the desmearing process or wet post-process such as plating, etc., enough.
OYA TOMONORI
KANBE KAZUYUKI
FUKUYO FUMITSUGU
TAKAOKA HIDEJI
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