Title:
VIA HOLE, SEMICONDUCTOR DEVICE HAVING VIA HOLE, AND FORMING METHOD OF SAME VIA HOLE
Document Type and Number:
Japanese Patent JP2005033116
Kind Code:
A
Abstract:
To form a plating film on the inner surface of a via hole in a good state.
In the via hole which brings the front and rear surfaces of a semiconductor substrate into continuity by plating the inside of a through hole provided in the semiconductor substrate, there are provided in the peripheral surface of the through hole, bubble exhausting grooves for exhausting the bubble generated inside the through hole to the outside when plating.
Inventors:
CHAEN KATSUHIRO
Application Number:
JP2003273227A
Publication Date:
February 03, 2005
Filing Date:
July 11, 2003
Export Citation:
Assignee:
SONY CORP
International Classes:
C25D7/12; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; C25D7/12
Attorney, Agent or Firm:
Kenichiro Matsuo