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Title:
VIBRATION CONTROL STRUCTURE FOR BUILDING COMPOSITE PANEL AND FLOOR BOARD
Document Type and Number:
Japanese Patent JPH09203153
Kind Code:
A
Abstract:

To restrain vibration of building boards to prevent sound propagation so that a damping structure can be used in insulating ceilings, floors, and walls from sounds by bonding two building boards together, such as plywood or gypsum board, using an acrytic emulsion type adhesive.

Two building boards 11, 12 are bonded together with an acrylic emulsion type damping adhesive 13. I n that case, the building boards 11, 12 may be of the same kind or different and selected to suit purposes. A composite building panel 10 for use on ceilings or walls, if it is used on a floor by bonding two or more gypsum boards together, for example, is formed by bonding plywood and the gypsum boards together. The damping adhesive 13 is preferably an acrylate viscous material, applied by a sufficient amount to form uniform layers over the whole mating surfaces. Thus, a structure is simplified for the insulation of floor plates from sounds, and work execution or the work can be quickly carried out on-site and in a prefabricated-building factory at reduced cost.


Inventors:
OIKE TSUKASA
KAWATSU YUKIO
OHASHI MASAHIKO
Application Number:
JP3269396A
Publication Date:
August 05, 1997
Filing Date:
January 25, 1996
Export Citation:
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Assignee:
MISAWA CERAMICS KK
IDA SANGYO KK
International Classes:
E04B5/43; E04B1/98; E04F15/18; E04F15/20; (IPC1-7): E04B5/43; E04B1/98; E04F15/18; E04F15/20
Attorney, Agent or Firm:
Noriaki Goto (1 outside)



 
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