Title:
制振装置
Document Type and Number:
Japanese Patent JP7377753
Kind Code:
B2
Abstract:
To provide a holding structure for a plate material for efficiently absorbing vibration energy.SOLUTION: A damping device according to an embodiment of the present invention comprises: a first plate part including a deformation region, a first holding region provided at one end part of the deformation region, and a second holding region provided at the other end part of the deformation region, and in which the first holding region and the second holding region have lower yield shear force than that of the deformation region; a second plate part arranged on the side of a first surface of the first plate part; a first fixing part for fixing the second plate part in such a manner that it is rotatable with respect to the first plate part in the first holding region; and a second fixing part for fixing the second plate part in such a manner that it is rotatable with respect to the first plate part in the second holding region.SELECTED DRAWING: Figure 2
Inventors:
Demin Fung
Yasuhito Sasaki
Yasuhito Sasaki
Application Number:
JP2020053297A
Publication Date:
November 10, 2023
Filing Date:
March 24, 2020
Export Citation:
Assignee:
Fujita Co., Ltd.
International Classes:
F16F15/02; E04H9/02; F16F7/12
Domestic Patent References:
| JP7021927U | ||||
| JP2001065193A | ||||
| JP2008138436A | ||||
| JP2000073606A |
Attorney, Agent or Firm:
Patent Attorney Corporation Takahashi Hayashi and Partners