To provide a vibration sensor having a movable part by using a microelectromechanical system, which is small, light, strongly-built and made up at a low cost, and to provide a method for manufacturing the vibration sensor, a pedometer, an acceleration sensor and a seismic detector.
The vibration sensor 10 is made up by using a semiconductor substrate 11 and a base substrate 12 to be joined thereto, to which a fine processing technology is applied. The semiconductor substrate 11 comprises: an arm part 112 having a fixed one end; a movable part (head part) 111 swingably disposed at the other end of the arm part; and current-carrying parts 113-115 which are composed of a first conductive part 113 disposed at one edge of the swing locus of the movable part along one direction, and second conductive parts 114, 115 fixed on positions opposite to the first conductive part 113, and which output electrical signals representing a mechanical contact or a change in distance between the first conductive part and the second conductive parts, when the movable part swings along the one direction due to vibration or impact from the outside.
COPYRIGHT: (C)2008,JPO&INPIT
NARA TAKAYUKI
BABA TAKEHIRO
HANAOKA KUNIKAZU
TAKANE KK