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Title:
VOID-INCLUDING MATERIAL
Document Type and Number:
Japanese Patent JPH10102363
Kind Code:
A
Abstract:

To provide a void-including material, high in weight, excellent in flame resistance, antibacterial properties, high in compressive elasticity, high in air-permeability, etc., and suitable for use in a wide range of industrial and manufacturing fields.

This void-including material 1 is constituted of a fiber material and an upper surface part 2 and a lower surface part 3 in which numerous hexagonal openings 2a and 3a are formed are connected to be integrated with supporting threads 4. When one surface out of the upper surface 2 and the lower surface 3 is brought to a base surface, a relative position of the hexagonal openings 2a and 3a in the upper surface 2 and the lower surface 3 is sifted to anyone of positions to right and left and/or above and below and interior angles of the supporting threads, which support the openings 2a and 3a of the upper surface 2 and the lower surface 3, against the upper surface 2 and the lower surface 3 are mixed within the range of 30-90° depending on regularity of the openings 2a and 3a. The thickness of this material is 5-40nm and the amount of the fiber filled up in a unit volume is ≤10%.


Inventors:
MIWA MASAHIKO
OKAMOTO SHIGETOMI
Application Number:
JP25790996A
Publication Date:
April 21, 1998
Filing Date:
September 30, 1996
Export Citation:
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Assignee:
UNITIKA LTD
UNITIKA TECHNOS KK
International Classes:
D01F6/62; A01N25/00; A01N25/08; D01F1/07; D03D25/00; D04B21/00; D04B21/14; (IPC1-7): D04B21/14; A01N25/00; A01N25/08; D01F1/07; D01F6/62; D03D25/00; D04B21/00
Attorney, Agent or Firm:
Yoshihiro Morimoto