Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
VOLUMINOUS RESIN MOLDING AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2004098963
Kind Code:
A
Abstract:

To provide a resin molding having a tall height and a voluminous feelings, which is not influenced by shrinking of the resin, is suitable to a surface of an object to be installed even when deformation after the molding occurs, and suppresses a gap between the surface of the object and the resin molding below a permissible level.

The resin molding A having a tall height H from a installed surface S1 to an upper end of a designing surface S2 and having a voluminous feelings is provided with a synthetic resin shell 1 for forming the designing surface S2 having a substantially uniform thickness and molded into a shape wherein a bottom surface thereof is opened, a rubber filler 2 for forming the installed surface S1 adhered to an inner surface of the shell 1, and double-sided adhesive tape 3 with releasing paper 3a adhered to the installed surface S1 of the rubber filler 2.


Inventors:
MURATA KYOICHI
Application Number:
JP2002266481A
Publication Date:
April 02, 2004
Filing Date:
September 12, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA YOSHIE
International Classes:
B60R13/04; B29C65/50; B29L31/30; (IPC1-7): B60R13/04; B29C65/50