Title:
ウェーハ温度ランピング中でのウェーハの放射状温度勾配制御方法および装置
Document Type and Number:
Japanese Patent JP4495340
Kind Code:
B2
Abstract:
A method and apparatus for controlling the radial temperature gradients of a wafer and a susceptor while ramping the temperature of the wafer and susceptor using a first heat source that is primarily directed at a central portion of the wafer, a second heat source that is primarily directed at an outer portion of the wafer, a third heat source that is primarily directed at a central portion of the susceptor, and a fourth heat source that is primarily directed at an outer portion of the susceptor. Ramping of the wafer and susceptor temperature is accomplished by applying power to the first, second, third and fourth heat sources. During ramping, the ratio of the first and second heat source powers is varied as a function of the wafer temperature and the ratio of the third and fourth heat source powers is varied as a function of the susceptor temperature.
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Inventors:
Anderson, Roger, N.
Carlson, David, Kay.
Carlson, David, Kay.
Application Number:
JP2000547645A
Publication Date:
July 07, 2010
Filing Date:
April 12, 1999
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/205; H01L21/00; H01L21/26; H01L21/324
Domestic Patent References:
| JP7029843A | ||||
| JP6326078A | ||||
| JP9263939A | ||||
| JP10098084A | ||||
| JP11067681A | ||||
| JP11145073A | ||||
| JP60000727A | ||||
| JP3218624A | ||||
| JP5005588A | ||||
| JP5114570A | ||||
| JP11204402A | ||||
| JP7058025A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada