Title:
ダイシングテープ一体型ウエハ裏面保護フィルム
Document Type and Number:
Japanese Patent JP5805367
Kind Code:
B2
Abstract:
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored, and the colored wafer back surface protective film has an elastic modulus (23° C.) of 3 GPa or more. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
Inventors:
Takamoto Naohide
Application Number:
JP2009251127A
Publication Date:
November 04, 2015
Filing Date:
October 30, 2009
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; B23K26/00; C09J7/02; C09J7/24; C09J7/25; C09J7/28
Domestic Patent References:
| JP2006140348A | ||||
| JP2008202046A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office