To provide a wafer chamfering method which can process the upper and the lower surface widths even in a lapping process.

A chamfering process is carried out to position the center P in the thickness direction of the peripheral edge of a wafer W at the center M of the grinding groove 110 of an outer periphery grinding wheel 108 constantly. The wafer W is ground evenly at the upper side and the lower side, and when a lapping process is carried to the wafer W, the process is carried out to make thinner evenly to the upper side and the lower side, from the thick part of the wafer W, and as a result, the wafer W is made in the even surface widths at the upper side and the lower side.