Title:
WAFER CHUCK DEVICE
Document Type and Number:
Japanese Patent JPH05121289
Kind Code:
A
Abstract:
PURPOSE: To make a wafer chuck light in weight and to make a resolving power stable.
CONSTITUTION: A wafer chuck 1 is made light in weight by cutting a useless part thereof, while a contact surface is lessened by increasing a vacuum groove 2 in a chuck surface with which the rear of a wafer comes into contact. This constitution produces the effects of reduction of a vacuum error, a reproducing operation, the saving of articles of consumption, and the improvement of a product processing capacity, etc.
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Inventors:
KIYOUZUKA TSUTOMU
Application Number:
JP31162191A
Publication Date:
May 18, 1993
Filing Date:
October 29, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/30; H01L21/027; H01L21/68; H01L21/683; (IPC1-7): H01L21/027; H01L21/68
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)