To prevent the environments of the processes for laminating the respective layers constituting a wafer from being contaminated, by cleaning the outer peripheral portion of the wafer without reducing the productivity of the wafer.

A wafer cleaning apparatus has a grinding means for grinding the outer peripheral portion of a wafer held on a chuck table, a polishing means for subjecting the outer peripheral portion of the wafer to a mirror finishing which has been so held on the chuck table as to grind its outer peripheral portion by the grinding means, and a pressure adjusting means for making the grinding means or the polishing means act by a predetermined pressure on the wafer held on the chuck table. By these means, the wafer cleaning apparatus so removes efficiently the substances stuck on the outer peripheral portion of the wafer as to subjecting it to the mirror finishing.