Title:
ウエハー洗浄装置及び方法
Document Type and Number:
Japanese Patent JP4914413
Kind Code:
B2
Abstract:
In an apparatus and method of generating an ultrasonic vibration, an ultrasonic vibration generated in an ultrasonic vibration generator is transmitted through a material layer to control the intensity and the direction of the ultrasonic vibration. In an apparatus and method of cleaning a wafer, a cleaning solution supplier supplies a cleaning solution for cleaning the wafer onto the wafer. An ultrasonic vibration generator generates an ultrasonic vibration. The ultrasonic vibration is transmitted through a material layer of a transmission member to control the intensity and the direction of the ultrasonic vibration. The ultrasonic vibration is applied to the cleaning solution.
Inventors:
Anki
Chung
Boram Chang
Chung
Boram Chang
Application Number:
JP2008241476A
Publication Date:
April 11, 2012
Filing Date:
September 19, 2008
Export Citation:
Assignee:
SEMES CO., LTD.
International Classes:
H01L21/304; H02N2/00
Domestic Patent References:
| JP2000216126A |
Attorney, Agent or Firm:
Atsushi Honda
Miho Ikegami
Miho Ikegami