PURPOSE: To make it possible to hold wafer in vacuum and prevent the transfer of foreign matters to wafer.
CONSTITUTION: A holding equipment 20 is formed with a dielectric having an electric resistivity of less than 1010Ω.cm and is equipped with a main body 21 having a holding surface 22, a positive electrode member 23 provided on the main surface at the opposite side of the holding surface 22 of the main body and a voltage generating device 26 for generating an electric potential between the positive electrode member 23 and a wafer 1; and a controller 30, which controls the wafer adsorption force of the holding equipment 20 to an optimum value by adjusting the voltage generating device 26 to a predetermined voltage value based on the relation between the potential difference and the wafer adsorption force of the holding equipment 20, is connected to the holding equipment 20. By doing this, a potential difference is generated between the wafer 1 and the positive electrode member 23 by the voltage generating device 26 and the wafer 1 is adsorbed to the main body 21 by an electrostatic force.
| WO/1997/011623 | MODULAR SYSTEM |
| JP2001189365 | SUBSTRATE-PROCESSING APPARATUS |
| JPH0781754 | CLEAN TRANSPORT SYSTEM |
NOMURA HISAFUMI
MIYAMOTO YOSHIYUKI
TOKISUE HIROMITSU
KITSUNAI HIROYUKI
HITACHI TOKYO ELECTRONICS