Title:
ウェハ分断装置及び方法
Document Type and Number:
Japanese Patent JP7271086
Kind Code:
B2
Abstract:
To provide a wafer cutting apparatus and method for smoothly cutting a wafer.SOLUTION: A grinding apparatus 1 includes: a grindstone 21 that grinds a wafer W having a modified layer RL formed therein; a vibrator 4 that vibrates the grindstone 21; and a slide guide 24 that regulates vibration of the grindstone 21 in the vertical direction V. The grinding apparatus 1 grinds the wafer W while vibrating the grindstone 21, thereby extending a crack c in the wafer W and dividing the wafer.SELECTED DRAWING: Figure 5
Inventors:
Masaki Kanazawa
Kenji Igarashi
Kenji Igarashi
Application Number:
JP2018027435A
Publication Date:
May 11, 2023
Filing Date:
February 19, 2018
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/301; B23K26/53; B24B1/00; B24B1/04; B24B7/04; B24B7/22; H01L21/304
Domestic Patent References:
| JP2015220383A | ||||
| JP2016193480A | ||||
| JP2017177250A | ||||
| JP2011101939A |
Attorney, Agent or Firm:
Takamitsu Shimizu