Title:
WAFER DIVISION METHOD
Document Type and Number:
Japanese Patent JP2022110511
Kind Code:
A
Abstract:
To provide a wafer division method capable of suppressing chipping on front and back surfaces.SOLUTION: A wafer division method includes a holding step 1001 of holding a tape side of a wafer to a holding table, a first cutting step 1002 of cutting the wafer held on the holding table with a first cutting blade along a dividing line to form a first processing groove with a depth that does not completely divide the wafer, a second cutting step 1003 of cutting the wafer along the first processing groove with a second cutting blade to which ultrasonic vibration is applied to form a second processing groove that does not completely cut the wafer in the groove bottom of the first processing groove, and propagating cracks downward from the second processed groove by ultrasonic vibration, and a chip spacing expansion step 1004 of expanding the tape and expanding a gap between chips formed starting from the crack.SELECTED DRAWING: Figure 5
Inventors:
HIRAIWA TAKU
Application Number:
JP2021005973A
Publication Date:
July 29, 2022
Filing Date:
January 18, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B1/00; B24B1/04; B24B19/02; B24B27/06; B26D7/08; B26F3/00; B28D5/00
Attorney, Agent or Firm:
Sakai International Patent Office