Title:
ウェーハの分割方法
Document Type and Number:
Japanese Patent JP7068028
Kind Code:
B2
Abstract:
A wafer dividing method includes a first step of cutting a back side of the wafer by using a cutting blade thereby forming a cut groove on the back side of the wafer along each division line, such that each cut groove has a depth not reaching the front side of the wafer from the back side thereof. A second step includes supplying a water-soluble liquid resin to the back side of the wafer thereby forming a water-soluble protective film on the back side of the wafer. A third step includes positioning a focal point of a laser beam on the bottom surface of each cut groove and next applying the laser beam to the bottom surface of each cut groove thereby fully cutting the wafer along each cut groove.
Inventors:
Obata Tsubasa
Application Number:
JP2018090472A
Publication Date:
May 16, 2022
Filing Date:
May 09, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/16; B23K26/38; B24B27/06
Domestic Patent References:
| JP2016219564A | ||||
| JP6085055A | ||||
| JP2017028170A | ||||
| JP2015134373A | ||||
| JP5211381A | ||||
| JP2007149860A | ||||
| JP2009194097A | ||||
| JP2017098452A | ||||
| JP2005096052A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office