Title:
WAFER DRYING APPARATUS
Document Type and Number:
Japanese Patent JPS62150828
Kind Code:
A
Abstract:
PURPOSE: To immediately dry a wafer after cleaning it for a short time by providing a nozzle of dry gas and a vacuum outlet on the same surface.
CONSTITUTION: A vacuum outlet 4 and a gas injection nozzle port 3 are formed on the same surface. Dry gas 5 is injected to a wafer 1 which is cleaned with pure water from an injection nozzle port 3 to splash water droplets 2 and the splashed droplets 2 are sucked from the outlet 4 to dry the wafer 1. Since both the nozzle port and the outlet are formed on the same surface, the wafer can be dried in a short time. The wafer can be utilized immediately after cleaned to prevent dust from being readhered thereto.
Inventors:
ISHIO NORIAKI
NAGAO SHIGEO
MIYAKE KUNIAKI
NAGAO SHIGEO
MIYAKE KUNIAKI
Application Number:
JP29080585A
Publication Date:
July 04, 1987
Filing Date:
December 25, 1985
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F26B7/00; F26B5/04; H01L21/304; (IPC1-7): F26B5/04; H01L21/304
Attorney, Agent or Firm:
Masatoshi Sato