Title:
WAFER DRYING EQUIPMENT
Document Type and Number:
Japanese Patent JP01020626
Kind Code:
A
Abstract:
PURPOSE: To suppress the generation of a static electricity by reducing the inner pressure of a drying equipment to a low pressure.
CONSTITUTION: A container 3 for setting a carrier which is " driven by a motor at a rotary shaft 4 as a center and contains a washed wafer is provided in a sealed vessel 1, and the wafer is dried by a centrifugal force. The vessel 1 is reduced through a vacuum pump 2 to a low pressure to reduce inner gas, thereby reducing a friction with the wafer and suppressing the generation of a static electricity. Accordingly, it can prevent dusts from adhering to the wafer and also prevents a semiconductor element from breaking down by static electricity.
Inventors:
Tsuno, Chika
Application Number:
JP1987000177618
Publication Date:
January 24, 1989
Filing Date:
July 15, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/02; B04B3/00; F26B5/08; H01L21/304; H01L21/02; B04B3/00; F26B5/00; (IPC1-7): B04B3/00; F26B5/08; H01L21/02; H01L21/304