To easily mount and dismount a workpiece and a fixing member having a dressing function when cutting the workpiece by using a cutting blade and cutting the fixing member for fixing a wafer simultaneously for dressing.

In a cutting device for cutting the wafer held on a chuck table by the cutting blade, a wafer fixing plate 8 held on the chuck table to fix the wafer is composed of: a plate main body 80 for dressing the cutting blade; and an adhesive layer 81 applied on a surface of the plate main body 80. By providing the adhesive layer 81 on a surface of the wafer fixing plate, the wafer is easily fixed or peeled off.