To provide wafer grinding method and device for efficiently grinding at least one surface of a wafer formed by slicing semiconductor ingot to a flat surface.

In this method, the one surface of the wafer formed by slicing the semiconductor ingot is ground. The method includes a wafer holding process for sucking and holding a center region of the other surface of the wafer by a chuck table for holding only a center region of the wafer, and a grinding process for grinding the one surface of the wafer by bringing a grinding wheel into contact with the one surface of the wafer, while rotating the chuck table for sucking and holding only the center region of the wafer and rotating a grinding wheel provided with the grinding wheel.