Title:
WAFER GRINDING METHOD AND WAFER GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2023029446
Kind Code:
A
Abstract:
To provide a wafer grinding method and a wafer grinding device capable of thinning a wafer to a finished thickness.SOLUTION: A wafer grinding method includes a rough grinding step of rough grinding the back surface of a wafer by rough grinding means until the thickness of the wafer reaches a second thickness that is thicker than a first thickness, which is the finished thickness, and a fine grinding step of performing fine grinding of the back surface of the wafer while gradually or continuously slowing down the feeding speed of fine grinding means after the rough grinding step has taken place, and setting the feeding speed of the fine grinding means so as to give priority to immediately stopping the fine grinding means right after grinding the back surface of the wafer until it reaches the first thickness.SELECTED DRAWING: Figure 8
Inventors:
Kazumasa Ishikawa
Application Number:
JP2022206691A
Publication Date:
March 03, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/304; B24B1/00; B24B7/00; B24B19/02
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
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