Title:
WAFER GRINDING METHOD
Document Type and Number:
Japanese Patent JP2023148230
Kind Code:
A
Abstract:
To shorten a time for washing a wafer whose electrode is exposed to an upper surface by being ground.SOLUTION: When a grinding step is completed, supply of pure water is stopped and scrap metal-dissolved water L2 is supplied to an upper surface 101 of a wafer 100, in a state where a height of a grinding stone 17 is maintained for a predetermined time, so as to wash the upper surface 101 to which an electrode is exposed and the grinding stone 17. This can shorten a time required for the washing in comparison with a case where the wafer 100 is conveyed to another washing device and washed there, and further can shorten a time after the grinding step is completed to the washing is started, which can improve a washing effect with the scrap metal-dissolved water L2.SELECTED DRAWING: Figure 3
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Inventors:
SATO TOMOAKI
Application Number:
JP2022056137A
Publication Date:
October 13, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B23Q11/00; B24B55/02; B24B55/06; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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