To solve the problem of the necessity of higher-precision wafer heating caused by an increase in the size of a wafer, since quick a temperature increase and decrease are required, and uniform temperature distribution is required accordingly, to lighten a heat history when wafer heating is carried out, though lamp heating system sheeting equipment has been in pratical use, and quick the temperature increase and decrease are performed for requests by performing the fine control of the speed of the temperature increase and decrease of a heater, the arrangement of lamps for the heater, the shape of a reflecting mirror and materials of reflecting surfaces.

Between a wafer and the lamps being heating sources, an optical system is arranged, and heat emitted onto the wafer is uniformized, and the temperature distribution of the wafer when its temperature increases or decreases is uniformized.