Title:
WAFER HEATER
Document Type and Number:
Japanese Patent JPH10242252
Kind Code:
A
Abstract:
To provide a wafer heater having a wafer support board tightly bonded to a support tube and superior air-tightness with little particle contamination.
The heater comprises a wafer holding board 2 contg. resistance heater elements 4, thereby forming a wafer holder 1, and support tube 7 which mounts the board 2 in a treating chamber 30. Both are made of a sintered Al nitride and bonded into a unified body by baking them through an Al nitride bond layer 9 contg. rare earth oxides under the condition that the rare earth components of the bond layer 9 are diffused in the sintered Al nitride block which constitutes the board 2 and tube 7.
Inventors:
KUCHIMACHI KAZUICHI
KUKIDA AKIHIRO
KUKIDA AKIHIRO
Application Number:
JP4557497A
Publication Date:
September 11, 1998
Filing Date:
February 28, 1997
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C04B37/00; C23C14/50; C23F4/00; H01L21/203; H01L21/205; H01L21/302; H01L21/3065; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; C04B37/00; C23C14/50; C23F4/00; H01L21/203; H01L21/205
Previous Patent: WAFER HOLDER
Next Patent: METHOD AND APPARATUS FOR PEELING PROTECTIVE SHEET FROM SEMICONDUCTOR SUBSTRATE
Next Patent: METHOD AND APPARATUS FOR PEELING PROTECTIVE SHEET FROM SEMICONDUCTOR SUBSTRATE