Title:
WAFER HEATING HEATER
Document Type and Number:
Japanese Patent JP2013251354
Kind Code:
A
Abstract:
To provide a wafer heating heater capable of greatly reducing time and trouble required for maintenance and cleaning of a chamber.
In the wafer heating heater comprising a heating body 10 for heating wafer, and a cylindrical support 15 for supporting the heating body, the heating body 10 is connected to the cylindrical support 15 detachably, and a part between the heating body 10 and the cylindrical support 15 is sealed by a seal member 18 in accordance with the connection. The detachable connection can be performed by rotating the heating body 10 centering on a central axis of the cylindrical support 15 while maintaining a compressed state after moving the heating body 10 toward the cylindrical support 15 to compress the seal member 18.
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Inventors:
NISHIMOTO NOBUHIRO
NATSUHARA MASUHIRO
MIKUMO AKIRA
NAKADA HIROHIKO
NATSUHARA MASUHIRO
MIKUMO AKIRA
NAKADA HIROHIKO
Application Number:
JP2012124027A
Publication Date:
December 12, 2013
Filing Date:
May 31, 2012
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/31
Domestic Patent References:
| JP2010025226A | 2010-02-04 | |||
| JPH07201495A | 1995-08-04 | |||
| JPH04329625A | 1992-11-18 | |||
| JP2010025226A | 2010-02-04 |
Attorney, Agent or Firm:
Noriyuki Tsujikawa
Masao Yamamoto
Masao Yamamoto