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Title:
WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS MOUNTING IT
Document Type and Number:
Japanese Patent JP2004253665
Kind Code:
A
Abstract:

To provide a wafer holder for a semiconductor manufacturing apparatus wherein the thermal uniformity of the wafer holding surface of a wafer holder having a wafer mounting surface is improved, and to provide a semiconductor manufacturing apparatus mounting the wafer holder for a semiconductor manufacturing apparatus.

A shaft for supporting the wafer holder having a wafer mounting surface is joined with the wafer holder. Provided that a distance (a) between the central axis of the shaft and the central axis of the wafer mounting surface is set to be ≤5% of the diameter L of the wafer mounting surface, it is possible to set the temperature distribution of a mounted wafer surface within ±1.0%. It is further possible to set the temperature distribution within ±0.5% provided that the distance (a) is set ≤1% of the diameter L.


Inventors:
NATSUHARA MASUHIRO
NAKADA HIROHIKO
HASHIKURA MANABU
Application Number:
JP2003043425A
Publication Date:
September 09, 2004
Filing Date:
February 21, 2003
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C23C14/50; C23C16/46; F27B5/14; F27D5/00; F27D11/00; H01L21/00; H05B3/74; H01L21/02; H01L21/68; H01L21/683; H01L21/687; (IPC1-7): H01L21/02; H01L21/68; H05B3/74
Attorney, Agent or Firm:
Minoru Nakano
Yoji Hattori
Mikio Yamaguchi
Hideaki Nishima