To provide a wafer holder for a semiconductor manufacturing apparatus wherein the thermal uniformity of the wafer holding surface of a wafer holder having a wafer mounting surface is improved, and to provide a semiconductor manufacturing apparatus mounting the wafer holder for a semiconductor manufacturing apparatus.
A shaft for supporting the wafer holder having a wafer mounting surface is joined with the wafer holder. Provided that a distance (a) between the central axis of the shaft and the central axis of the wafer mounting surface is set to be ≤5% of the diameter L of the wafer mounting surface, it is possible to set the temperature distribution of a mounted wafer surface within ±1.0%. It is further possible to set the temperature distribution within ±0.5% provided that the distance (a) is set ≤1% of the diameter L.
NAKADA HIROHIKO
HASHIKURA MANABU
Yoji Hattori
Mikio Yamaguchi
Hideaki Nishima
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