Title:
WAFER HOLDER
Document Type and Number:
Japanese Patent JP2023076260
Kind Code:
A
Abstract:
To provide a wafer holder with a simple structure, which is used when a warped wafer is held.SOLUTION: A wafer holder includes a holding base which has a circular holding surface, in which an annular first groove and an annular second groove surrounded by the first groove are formed on a holding surface side, and which includes a plurality of first suction holes opening in an area surrounded by the first groove and the second groove on the holding surface, a plurality of second suction holes opening in an area surrounded by the second groove on the holding surface, and a suction path communicating with the first suction holes and the second suction holes and opening on the back surface opposite to the holding surface, the first and second suction holes and the suction path being formed inside the holding base. The first suction holes and the second suction holes are designed such that pressure loss in each of the first suction holes is more than pressure loss in each of the second suction holes.SELECTED DRAWING: Figure 1
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Inventors:
OMURO YOSHIHIRO
Application Number:
JP2021189583A
Publication Date:
June 01, 2023
Filing Date:
November 22, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B23Q3/08; B23Q7/04; B24B41/06; H01L21/304
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato