Title:
WAFER IDENTIFICATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2006269490
Kind Code:
A
Abstract:
To provide a wafer identification method for handing over to the intermediate inspection process and assembly process of a wafer ID without putting the wafer ID on the surface of a wafer again, and to provide a method for manufacturing a semiconductor device.
The wafer identification method identifies a wafer 3 in a process for manufacturing a semiconductor including a process for putting a protective sheet 1 on a surface at the side of the device of the wafer 3, and for polishing the back of the wafer 3 for thinning the wafer. Identification information 2 is attached to the protective sheet 1 for each wafer 3, and the wafer 3 is individually identified by the identification information 2.
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Inventors:
UCHIDA ITSURO
Application Number:
JP2005081543A
Publication Date:
October 05, 2006
Filing Date:
March 22, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/02; H01L21/304
Attorney, Agent or Firm:
Akio Miyai
Makoto Ito
Makoto Ito
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