To solve the problem, wherein the inspection equipment for detecting defects in the edge region of a wafer there are no means for classifying the kinds of the defects or determination of mortality.

In this invention, lighting systems from different angles are used. The wavelength band of light source used for each lighting system is separated respectively. Thus, the reflection light and scattered light to be used for imaging can be discriminated from which light source the light comes. The intensity performance of the reflected light or scattered light by the illuminations of various directions varies, depending on the kinds of defects; and thus, the kinds of the defects can be classified, on the basis of these performance. Moreover, by combining the information of the detection size or the existing position with these classification, determination of mortality becomes possible.