Title:
ウェーハのレーザ加工方法
Document Type and Number:
Japanese Patent JP6935126
Kind Code:
B2
Abstract:
A laser processing method for a wafer that is segmented by plural planned dividing lines set on a surface in a lattice manner uses a laser processing apparatus including a laser beam irradiation unit that irradiates, through a collecting lens, the wafer held by a chuck table, with plural laser beams formed by being oscillated by a laser beam oscillator and being split by a laser beam splitting unit. The method includes a processed groove forming step of irradiating the wafer with the plural laser beams along the planned dividing lines and forming a processed groove along the planned dividing lines. The plural laser beams split by the laser beam splitting unit are arranged in a line manner along a direction that is non-parallel to an extension direction of the planned dividing line irradiated with the plural laser beams.
Inventors:
Yuto Ban
Application Number:
JP2017075405A
Publication Date:
September 15, 2021
Filing Date:
April 05, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/064; B23K26/364; B23K26/38
Domestic Patent References:
| JP2014223677A | ||||
| JP2013173160A | ||||
| JP2011067873A | ||||
| JP2016021567A | ||||
| JP2004268144A | ||||
| JP2016203222A | ||||
| JP8243766A | ||||
| JP2011167723A | ||||
| JP2016208035A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro