To provide a carrier with a die storing cavity for storing a die regarding a wafer level package (WLP) structure.

A package structure 6 is provided with a substrate 2, which has a die storing cavity 4 formed in the upper face of the substrate 2, and a through-hole structure 6 formed therethrough. A terminal pad 8 is formed under the through-hole structure 6. The substrate 2 includes a conductive trace 10 formed on the lower face of the substrate 2 while being in contact with it. A die 16 is arranged in the die storing cavity 4 by adhesion. A dielectric layer 18 is formed on the die 16 and the substrate 2. A redistribution metal layer (RDL) 24 is formed on the dielectric layer 18 so as to connect the die 16 with the through-hole structure 6. Conductive bumps are connected to the terminal pad 8.