To provide a wafer machining method by which a wafer having a suppressed variation in warpage and thickness can be obtained.
The wafer machining method includes a step of providing a wafer 10a having an in-plane thickness distribution, a measuring step of measuring each of the coordinates of a plurality of in-plane positions of the wafer 10a and the thickness of the wafer 10a at each of the positions and acquiring information on the thickness distribution of the wafer 10a, and a thickness uniformizing step of machining the wafer 10a at least in a position, where the thickness is large, by a numerical control machining method based on the information on the thickness distribution to reduce the thickness of the position. The machining means used in the numerical control machining method is blasting.
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Mitsue Obuchi
Misa Nagata