Title:
ウェーハの製造方法およびウェーハ
Document Type and Number:
Japanese Patent JP7021632
Kind Code:
B2
Abstract:
A manufacturing method of a wafer with a notch includes: polishing principal surfaces of the wafer; mirror-polishing a notch chamfered portion of the notch; mirror-polishing an outer-periphery chamfered portion of an outer peripheral portion of the wafer; and finish-polishing one of principal surfaces of the wafer, the finish-polishing being performed after performing the mirror-polishing of the notch chamfered portion, the polishing of the principal surfaces, and the mirror-polishing of the outer-periphery chamfered portion in this order.
Inventors:
Torii Kantaro
Application Number:
JP2018245301A
Publication Date:
February 17, 2022
Filing Date:
December 27, 2018
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B9/00; B24B1/00; B24B37/08; B24B37/10; H01L21/304
Domestic Patent References:
| JP2002299290A | ||||
| JP2017157796A | ||||
| JP2014229650A |
Attorney, Agent or Firm:
Intellectual Property Office
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