Title:
ウェーハの製造方法
Document Type and Number:
Japanese Patent JP7258437
Kind Code:
B2
Abstract:
To form a wafer having a comparably thick tin layer easier than plating.SOLUTION: A manufacturing method of a wafer having a metal layer formed includes a seed layer forming step for forming a seed layer made of metal on a face of a wafer, a tin sheet setting step for setting a tin sheet thicker than the seed layer on the seed layer, a heating step for heating the wafer to melt at least the tin sheet, a cooling step for cooling the wafer after the heating step to form the wafer having a metal layer containing a tin layer formed on the face of the wafer.SELECTED DRAWING: Figure 2
Inventors:
Sakae Matsuzaki
Application Number:
JP2019128132A
Publication Date:
April 17, 2023
Filing Date:
July 10, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
C23C28/02; H01L21/301
Domestic Patent References:
| JP2001176890A | ||||
| JP2008109059A | ||||
| JP2009135486A | ||||
| JP2014192494A | ||||
| JP2000138250A |
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
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