Title:
ウエハ載置台
Document Type and Number:
Japanese Patent JP7429208
Kind Code:
B2
Abstract:
A wafer placement table includes a ceramic base, a first cooling base, and a second cooling base. The ceramic base has a wafer placement surface and incorporates a wafer attracting electrode and a heater electrode. The first cooling base is bonded via a metal bonding layer to a surface of the ceramic base on a side opposite to the wafer placement surface and has a first refrigerant flow channel capable of switching between supply and stop of supply of first refrigerant. The second cooling base is attached via a space layer, capable of supplying heat-transfer gas, to a surface of the first cooling base on a side opposite to the metal bonding layer and has a second refrigerant flow channel capable of switching between supply and stop of supply of second refrigerant.
Inventors:
Hiroshi Takebayashi
Tatsuya Kuno
Yasushi Inoue
Tatsuya Kuno
Yasushi Inoue
Application Number:
JP2021132887A
Publication Date:
February 07, 2024
Filing Date:
August 17, 2021
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L21/31; H01L21/3065; H01L21/683
Domestic Patent References:
| JP2006261541A | ||||
| JP2020145238A | ||||
| JP2017178663A | ||||
| JP2015035447A | ||||
| JP2011192661A |
Foreign References:
| WO2020054682A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation ITEC International Patent Office