PURPOSE: To offer a method and device for placing a wafer inside a template of a polishing plate automatically and very accurately without requiring human labor.

CONSTITUTION: When a semiconductor wafer 7 is placed for polishing inside a template 3 provided on a polishing plate 1, respective positions are numerically analyzed for fine adjustment in order to correctly place the semiconductor wafer 7 at the center of the template 3. In a wafer placing device for placing the semiconductor wafer 7 inside the template 3 provided on the polishing plate 1, an index table 2 for holding the polishing plate 1 and rotating, a wafer carrying arm 5 for attracting the wafer 7, moving in the horizontal and vertical directions and placing the wafer 7 inside the template 3, and an image processing device provided above the template 3 for placing the wafer 7 are provided.