Title:
WAFER PLATING APPARATUS AND WAFER PLATING METHOD
Document Type and Number:
Japanese Patent JP3942507
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problems that, in the conventional jet stream type plating apparatus 30, there are many fine bubbles 45 in a plating liquid 36, and they move on the flow of the plating liquid 36, but , when the fine bubbles 45 enter the gaps between photoresists 44, they are made stable and do not escape, and, particularly, in the case of a small-sized deep holes such as the photoresists 44 for forming a bump, the bubbles 45 are extremely hard to escape, and, since the plating liquid 36 is not brought into contact with the part stuck with the bubbles 45, normal plating can not be applied.
SOLUTION: A wafer 11 is placed on a stage 12. An elastic O ring 15, and further, a seal ring 16 are placed on the outer circumferential part of the wafer 11. A plating tank composed of the wafer 11, the O ring 15 and the seal ring 16 is filled with a plating liquid 17. A disk-shaped anode 21 with many anode pins 22 planted is arranged so as to confront with the wafer 11. The tips of the anode pins 22 are dipped into the plating liquid 17, plating the wafer 11.
Inventors:
Okaji Seiji
Application Number:
JP2002219170A
Publication Date:
July 11, 2007
Filing Date:
July 29, 2002
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
C25D17/00; C25D17/06; C25D17/12; C25D21/00; C25D21/04; C25D21/10; C25D21/12; H01L21/288; H01L21/60; H01L21/68; H01L21/683; (IPC1-7): C25D17/00; C25D17/06; C25D17/12; C25D21/00; C25D21/04; C25D21/10; C25D21/12; H01L21/288; H01L21/60; H01L21/68
Domestic Patent References:
| JP10298795A | ||||
| JP2002004091A | ||||
| JP11080968A | ||||
| JP6065794A |
Attorney, Agent or Firm:
Tatsuo Tokumaru
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