To provide a wafer polishing device with which distributions of film thickness, film quality and polishing shape which gradually change in a radial direction can be corrected.

The surface of a carrier 24 opposed to a protection sheet 34 is provided with an air supply path 36 formed in the vicinity of its outer periphery, and a plurality of air discharge paths 38 formed on the inner side of the air supply path 36. The air supply path and the air discharge paths are connected to an air control means for controlling the amount of air to be supplied and discharged. The air supply path and the air discharge paths are communicated with a circumferential groove formed in the surface of the carrier 24. The pressing force for pressing the protection sheet towards a wafer is changed from the outer periphery of the wafer towards the center by the air control means.