Title:
WAFER POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2616736
Kind Code:
B2
Abstract:
PURPOSE: To make the uneven sections caused by forming devices flat even if there are deformed sections or uneven sections in a wafer and restrain the consumption of polishing liquid for maintaining polishing performance stable for a long time in a wafer polishing device.
CONSTITUTION: Even if there are deformed sections or uneven sections due to the unevenness in thickness in a wafer 12, the deformation of the wafer 12 is reformed to a certain extent and the pressing force in the face of the wafer 12 is made uniform while copying the reformed wafer face for polishing the wafer 12 by providing a resin sheet 1 for polishing the wafer 12 with polishing liquid which is supplied while sliding on the wafer 12 and a tension mechanism 2 which gives proper tension and desired elastic strength to this resin sheet 1. For the material of the resin sheet 1, hydrophilic material which is not acted by hydrofluoric acid must be used.
Inventors:
Next door Shinichi
Application Number:
JP984395A
Publication Date:
June 04, 1997
Filing Date:
January 25, 1995
Export Citation:
Assignee:
NEC
International Classes:
H01L21/304; B24B37/20; B24B37/24; B24B53/017; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP750234A | ||||
| JP62259769A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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