Title:
WAFER POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3428566
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent corrugated deformation of a polishing pad and to prevent excessive polishing of the outer peripheral part of a wafer by concentrically disposing a retainer ring in the outer periphery of a carrier supporting a wafer, and operating a ring pressure adjusting mechanism so as to allow adjusting the abutting pressure of the ring to the pad.
SOLUTION: A disc-like platen 22 is installed on a base to be rotated round the vertical axis by a platen driving mechanism and a polishing pad 24 stuck on the upper surface polishes a wafer W. The wafer W is supported on plural wafer holding heads 32 provided on a discoid carousel (head driving mechanism) 30 through a carrier 46 on the lower surface of a diaphragm 44. In this case, a retainer ring 50 is disposed concentrically in the outer periphery of the carrier 46, and an annular tube 54 is interposed between the ring 50 and a fitting part 38A of the head main body 34. The pressure in the tube 54 is adjusted by a pressure adjusting mechanism 60 to adjust the abutting pressure of the retainer ring 50 to the polishing pad 24.
Inventors:
Hiroyuki Kobayashi
Osamu Endo
Hiroo Miyairi
Osamu Endo
Hiroo Miyairi
Application Number:
JP2000159082A
Publication Date:
July 22, 2003
Filing Date:
February 28, 1995
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B24B37/005; B24B37/04; B24B37/30; B24B37/32; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304
Domestic Patent References:
| JP8229808A | ||||
| JP679618A | ||||
| JP55157473A | ||||
| JP2278822A | ||||
| JP56146667A | ||||
| JP63300858A |
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)