Title:
ウェーハ研磨用ヘッド
Document Type and Number:
Japanese Patent JP7372107
Kind Code:
B2
Abstract:
Provided is a wafer polishing head which can increase productivity of a wafer polishing device and can enhance efficiency of a polishing process. The wafer polishing device (1) includes a chuck mechanism having a rubber chuck (10) formed of an elastic body and a rigid body chuck (11) formed of a rigid body, a first pressure adjustment mechanism (23) which can supply air to a periphery of the rubber chuck (10), and a second pressure adjustment mechanism (24) which can supply air to a periphery of the rigid body chuck (11). In the wafer polishing device (1), a processing method can be switched by switching between air supply by the first pressure adjustment mechanism and air supply by the second pressure adjustment mechanism. Thereby, the wafer polishing head can have both functions of the rubber chuck type chuck mechanism and the rigid body chuck type chuck mechanism. Therefore, two wafer polishing heads are not required, such that productivity of the wafer polishing device can be increased. In addition, a process of replacing the wafer polishing head can be eliminated, such that efficiency of the polishing process can be enhanced.
Inventors:
Mochimaru Junyuki
Hiroshi Kobayashi
Yasunari Igarashi
Yukio Uehara
Kazuhiro Takaoka
Hiroshi Kobayashi
Yasunari Igarashi
Yukio Uehara
Kazuhiro Takaoka
Application Number:
JP2019188954A
Publication Date:
October 31, 2023
Filing Date:
October 15, 2019
Export Citation:
Assignee:
Okamoto Machine Tool Co., Ltd.
International Classes:
B24B37/30; B24B37/005; B24B41/06; H01L21/304
Domestic Patent References:
| JP2005034935A | ||||
| JP2002346911A | ||||
| JP11309672A |
Attorney, Agent or Firm:
Masahisa Ohtake