Title:
WAFER POLISHING METHOD
Document Type and Number:
Japanese Patent JP2008049430
Kind Code:
A
Abstract:
To provide a wafer polishing method for simultaneously polishing a number of wafers such as sapphire substrates by causing no concentric unevenness.
The wafer polishing method is provided for polishing the wafers by securing the wafers to polishing head portions 10, and pressing the polishing head portions to a rotary surface plate 20 on which an abrasive cloth is mounted. According to the method, the rotary surface plate is reciprocatively moved (rocked) in a direction indicated by an arrow C which forms about 45 degrees with a rotational direction of the rotary surface plate indicated by an arrow B, at the center A of each polishing head portion.
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Inventors:
KAKIMOTO SANEYUKI
Application Number:
JP2006227502A
Publication Date:
March 06, 2008
Filing Date:
August 24, 2006
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B24B37/10; H01L21/304
Domestic Patent References:
| JPH05245755A | 1993-09-24 | |||
| JPH10249715A | 1998-09-22 | |||
| JPH11291167A | 1999-10-26 | |||
| JP2000135669A | 2000-05-16 | |||
| JP2000015557A | 2000-01-18 |
Attorney, Agent or Firm:
Akira Ueda