Title:
ウエハ位置決め装置
Document Type and Number:
Japanese Patent JP7402946
Kind Code:
B2
Abstract:
To provide a wafer delivery device capable of delivering a wafer with high precision without shifting the position of a wafer when the wafer is delivered to a predetermined table.SOLUTION: A wafer delivery device includes holding means 17 having a claw portion 20 that releases a wafer W onto a chuck table B11 when the wafer W is conveyed to a predetermined position above the chuck table B11 and holds the wafer in contact with the outer peripheral edge of the wafer W, and wafer guide means 18 having a guide surface 18d2 that is arranged at a position where the holding means 17 is not in contact with the wafer W when the holding means 17 holds the wafer W, and rotates to a position substantially perpendicular to the chuck table B11 and guides the transfer of the wafer W when the wafer W is released from the holding means 17.SELECTED DRAWING: Figure 7
Inventors:
Tomohiko Makino
Application Number:
JP2022150836A
Publication Date:
December 21, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/677; B65G49/07
Domestic Patent References:
| JP57110947U | ||||
| JP2011062789A | ||||
| JP2010056327A | ||||
| JP1261843A | ||||
| JP63056932A |
Foreign References:
| US20120220200 |
Attorney, Agent or Firm:
Takamitsu Shimizu