To provide a wafer prober which has excellent controllability without warp even when a probe card is pressed without release in a boundary of a junction due to attaching/detaching of a socket, etc., since an external terminal pin is tightly fixed, which prevents a wafer from being damaged or measured by mistake, and which has excellent temperature rise/fall characteristics.
The wafer prober in which a chuck top conductor layer is formed on a surface of a ceramic substrate and a guard electrode and/or a ground electrode is formed in the substrate. In the prober, one or both of the guard electrode and the ground electrode is electrically connected. The prober includes a through hole for electrically connecting to an external terminal, and a bag hole for exposing the hole.
HIRAMATSU YASUJI
ITO YASUTAKA
Kazunobu Shigehira