WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

Title:

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

Document Type and Number:

Japanese Patent JP3480442

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a wafer processing apparatus capable of reliably contacting a temperature measuring means for measuring the temperature of a wafer to the wafer.
SOLUTION: The wafer processing apparatus is composed of a temperature measuring means 60 for measuring the temperature of a wafer 50, and a biasing means 62 for biasing the temperature measuring means 60 to the wafer 50 so that the temperature measuring means 60 contacts the surface of the wafer 50.

Inventors:

Tetsuya Tatsumi

Application Number:

JP2000353997A

Publication Date:

December 22, 2003

Filing Date:

September 29, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

ソニー株式会社

International Classes:

H01L21/302; G01K1/14; H01L21/3065; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; G01K1/14; H01L21/3065

Domestic Patent References:

JP1315158A
JP5456483A
JP4732875A
JP3196544A

Attorney, Agent or Firm:

Takahisa Yamamoto

Previous Patent: DC-DC CONVERTER AND ELECTRONIC APPARATUS USING THE SAME

Next Patent: DEVICE AND METHOD FOR TRANSFERRING GFP FRAME