Title:
PROCESSING DEVICE OF WAFER, WASHING DEVICE, AND WASHING METHOD
Document Type and Number:
Japanese Patent JP2023161335
Kind Code:
A
Abstract:
To prevent a processed waste from adhering to a wafer outer peripheral part and prevent the wafer outer peripheral part from being damaged.SOLUTION: A washing method of washing a wafer W comprises: a preparation step of rotating a spinner table 10 holding the wafer W on a holding surface 11a by using a center of the holding surface 11a as an axis, and positioning a two-fluid nozzle 30 so that two fluids ejected from the two-fluid nozzle 30 are landed onto water at a center of the holding surface 11a; an upper surface washing step of moving the two-fluid nozzle 30 in a radial direction of the wafer W at a predetermined speed while ejecting the two fluids from the two-fluid nozzle 30, and washing an upper surface of the wafer W held on the holding surface 11a; and an outer peripheral washing step of washing an outer peripheral upper surface and an outer peripheral side surface of the wafer W by moving the two-fluid nozzle 30 to a position where the two fluids ejected from the two-fluid nozzle 30 moved in the radial direction of the wafer W come into contact with the outer periphery of the wafer W, and stopping the two-fluid nozzle 30 that brings the two fluids into contact with the outer peripheral upper surface and the outer peripheral side surface of the wafer W, for a predetermined time.SELECTED DRAWING: Figure 5
Inventors:
TAKEKAWA MASAHIRO
Application Number:
JP2022071671A
Publication Date:
November 07, 2023
Filing Date:
April 25, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office