Title:
ウエハ処理方法およびシステム
Document Type and Number:
Japanese Patent JP5112061
Kind Code:
B2
Abstract:
The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.
Inventors:
Bill kalenian
Tom Walsh
Dave Halley
Tom Walsh
Dave Halley
Application Number:
JP2007520431A
Publication Date:
January 09, 2013
Filing Date:
July 01, 2005
Export Citation:
Assignee:
Strasbourg
International Classes:
B24B37/04; B24B37/30; B24B37/34; H01L21/304; H01L21/677
Domestic Patent References:
| JP2003094325A | ||||
| JP2003092274A | ||||
| JP11207610A | ||||
| JP2002141318A | ||||
| JP866865A | ||||
| JP200380454A | ||||
| JP20046559A | ||||
| JP9225822A |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office
Katsuhisa Ito
Yasuhiko Sano
Katsuhisa Ito
Yasuhiko Sano